Thermoelectric module unit
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United States of America Patent
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-
May 22, 2001
Grant Date -
N/A
app pub date -
Sep 23, 1999
filing date -
Oct 21, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A thermoelectric module unit is provided with a thermoelectric module that comprises a partitioning plate, a thermoelectric semiconductor element fixed to the partitioning plate in a state passing through the partitioning plate but also in a state that is electrically insulated from the partitioning plate. A first metal electrode is connected to a first surface of the thermoelectric semiconductor element, and a second metal electrode is connected to a second surface of the thermoelectric semiconductor element. A first confined portion encloses a region from the partitioning plate towards the first surface and is also connected to a first heat pipe. An operating fluid is vacuum-sealed within the first confined portion and the first heat pipe.
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