Semiconductor wafer processing tapes
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United States of America Patent
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May 22, 2001
Grant Date -
N/A
app pub date -
Mar 30, 1998
filing date -
Mar 30, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.
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