Infrared imaging of ultrasonically excited subsurface defects in materials
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United States of America Patent
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May 22, 2001
Grant Date -
N/A
app pub date -
Sep 16, 1999
filing date -
Sep 16, 1999
priority date (Note) -
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Abstract
A thermal imaging system for detecting cracks and defects in a component. An ultrasonic transducer is coupled to the specimen through a malleable coupler. Ultrasonic energy from the transducer causes the defects to heat up, which is detected by a thermal camera. The ultrasonic energy is in the form of a pulse where the frequency of the ultrasonic signal is substantially constant within the pulse. A control unit is employed to provide timing and control for the operation of the ultrasonic transducer and the camera.
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