Substrate independent superpolishing process and slurry
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 22, 2001
Grant Date -
N/A
app pub date -
Jan 21, 1994
filing date -
Jan 21, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention utilizes a combination of chemical and mechanical finishing processes to polish a disk substrate surface to near atomic smoothness. Broadly speaking, the surface of a disk substrate that has been machined (i.e., rough ground) to a predetermined surface roughness is subjected to attack by a chemical formulation (called an attacking agent). The chemical formulation is used to soften the substrate material. Then, the softened material is 'wiped away' via mechanical action.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully