Importance

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Abstract

A stackable integrated circuit chip package comprising a carrier and a flex circuit. The flex circuit itself comprises a flexible substrate having opposed top and bottom surfaces, and a conductive pattern which is disposed on the substrate. The substrate is wrapped about and attached to at least a portion of the carrier such that the conductive pattern defines first and second portions. The chip package further comprises an integrated circuit chip which is electrically connected to the first portion of the conductive pattern such that an air path is defined between the integrated circuit chip and the carrier. The chip package is configured such that the second portion of the conductive pattern and the integrated circuit chip are each electrically connectable to another stackable integrated circuit chip package. A chip stack assembled using chip packages of the present invention is preferably used in conjunction with an active cooling system operative to circulate cooling air through the air path defined by each chip package.

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First Claim