Method for microplasma electrolytic processing of surfaces of electroconductive materials

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United States of America Patent

PATENT NO 6238540
SERIAL NO

09350167

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Abstract

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A method for microplasma electrolytic processing a surface of an electroconductive material, involves establishing an electrical circuit between this material, as a first electrode, and a counterelectrode, as a second electrode, by immersing the first electrode into an electrolyte that is in contact with the second electrode and applying an electrical voltage across the first and second electrodes with a power source. In a first step, only a portion of the surface of the material is immersed in the electrolyte, the size of that portion being dependent on an output power of the power source, a composition of the material, an electric regime used, a composition of the electrolyte, and a minimal current density at which a process of microplasma oxidation is stable. The surface of the material is then completely immersed in the electrolyte while the voltage is regulated to cause a current value I(t) between the first and second electrodes ranging from 0.9I

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Patent OwnerAddress
R-AMTECH INTERNATIONAL INC2101 - 112TH AVENUE NE SUITE 210 BELLEVUE WA 98004

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rakoch, Aleksandr Grigorevich Moscow, RU 2 22
Timoshenko, Aleksandr Vladimirovich Moscow, RU 2 22

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