Developing method and developing apparatus

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United States of America Patent

PATENT NO 6238848
SERIAL NO

09539378

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Abstract

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When a resist film formed on a substrate is exposed in a predetermined pattern and thereafter an exposed pattern is developed, a substance capable of decreasing fluidity of the developing solution is added to the developing solution, the developing solution to which the substance is added is caused to become low-fluid under a predetermined condition, the developing solution is applied onto the exposed resist film on the substrate, and thereafter a predetermined trigger is given to the developing solution to cause the developing solution to become high-fluid so as to allow developing to progress. Thereby, line width can be made uniform and defects do not tend to occur during coating of the developing solution.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Konishi, Nobuo Yamanashi-Ken, JP 30 1167
Omori, Tsutae Shirane-Machi, JP 21 415
Toshima, Takayuki Yamanashi-Ken, JP 89 985

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