Modified lead frame for improved parallelism of a die to package
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United States of America Patent
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-
May 29, 2001
Grant Date -
N/A
app pub date -
Jul 6, 1998
filing date -
Jul 6, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A structure and method are provided to allow a die to be packaged more uniformly and in parallel with a package by utilizing a lead frame having at least one cavity within the lead frame, thereby allowing excess die-attach epoxy can flow into the cavity or cavities and reducing the amount of contact surface area between the die and lead frame.
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