Wafer support with electrostatic discharge bus
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United States of America Patent
Stats
-
May 29, 2001
Grant Date -
N/A
app pub date -
Jun 21, 1999
filing date -
Jun 21, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wafer support featuring a polymer rack formed of parallel, spaced apart comb structures with spaced apart teeth into which wafers can loosely fit and a shank immediately below the teeth which is connected to lifter shafts. A conductive polymer bus bar runs along the shank less than a millimeter below the base of the teeth. The polymer rack will fit through a standard size wafer cassette for wafer transfer. The bus bar is connected to electrical ground, found at metal lifter shafts, by means of conductive polymer cross bars. The bus bar is close enough to one or more wafers to allow arcing from the wafer to the bus bar and then to ground when a wafer becomes highly charged with electrostatic charge, thereby discharging the wafer.
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