Producing method of a film-type transmission line and method of connecting to an existing line
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United States of America Patent
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-
Jun 5, 2001
Grant Date -
N/A
app pub date -
Sep 10, 1999
filing date -
Sep 11, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An exposed connecting portion is formed by partially removing a film substrate by such laser etching while leaving a transmission line pattern. A film-type transmission line is placed in such a manner as to overlap the exposed connecting portion and a transmission line pattern on a side to be connected. Bonding, for example thermo compression bonding, is applied to the two overlapped line patterns. Since a gold ribbon is not used and overlapping of a high-dielectric substrate and the film substrate is unnecessary, impedance irregularity is reduced. This makes it possible to carry out bonding without the medium of the film substrate and a connection with high reliability may be achieved.
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