Compression interconnect system for stacked circuit boards and method
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United States of America Patent
Stats
-
Jun 5, 2001
Grant Date -
N/A
app pub date -
Dec 17, 1999
filing date -
Dec 18, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An interface connector and method of connection provides balanced resilient contact force of sufficient magnitude for maintaining secure electrical connections between stacked circuit boards in high stress conditions, for example, at high acceleration, using a feed through connection while substantially minimizing size requirements. The interface connector includes a connector housing having a perimeter for fitting within such form factor and a pair of opposite substantially planar surface areas for confronting circuit boards in stacked relation thereto, openings through the connector housing in alignment with terminal pads on respective circuit boards, and electrical contacts in the openings; the electrical contacts connecting terminal pads of one circuit board to terminal pads of the other circuit board; the electrical contacts including a spline in an opening of the connector housing, a pair of contact arms extending from opposite ends of the spline and having respective contact areas ordinarily exposed from a respective opening beyond a respective planar surface of the connector housing when the contact arms are in free unconstrained relation, the contact areas of an electrical contact being compressed toward such planar surfaces and openings by engagement with terminal pads of respective circuit boards adjacent the connector housing, and the spline including a non-linear portion that bends toward engagement with a wall in the opening in response to moment caused by such compressing. A distributed, ground plane may be selectively connectable to respective contacts and my be used for electromagnetic interference (emi) shielding.
First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
| Patent Owner | Address | |
|---|---|---|
| OHIO ASSOCIATED ENTERPRISES INC | 1382 WEST JACKSON STREET A CORP OF DE PAINESVILLE OH 44077 |
International Classification(s)
Inventor(s)
| Inventor Name | Address | # of filed Patents | Total Citations |
|---|---|---|---|
| Roath, Alan L | Madison, OH | 17 | 384 |
| Venaleck, John T | Painesville, OH | 54 | 1278 |
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| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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