High density wire bond BGA
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United States of America Patent
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-
Jun 5, 2001
Grant Date -
N/A
app pub date -
Jun 14, 1999
filing date -
Jun 14, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A new method is provided for creating high-density packages for wire bonded chips. The invention uses a combination of BUM technology and thin film deposition techniques to create the required interface between the contact points of the BGA device and the contact balls of the BGA substrate. Cavities are created on the metal panel substrates for IC chip insertion.
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