Buffer station on CMP system
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 12, 2001
Grant Date -
N/A
app pub date -
Apr 2, 1999
filing date -
Apr 2, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A chemical mechanical polishing system is provided having a buffer station disposed therein or adjacent thereto. The buffer station includes two or more substrate supports for supporting two or more substrates adjacent to an inspection station. The two or more substrate supports are mounted on a mounting plate which is connected to an actuator for moving a pair of substrate supports laterally towards or away from each other over the inspection station.
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Cited Art Landscape
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