Wet processing methods for the manufacture of electronic components using liquids of varying temperature
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United States of America Patent
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Jun 12, 2001
Grant Date -
N/A
app pub date -
Jun 2, 1999
filing date -
Jun 2, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is directed to wet processing methods for the manufacture of electronic component precursors, such as semiconductor wafers used in integrated circuits. More specifically, this invention relates to methods of manufacturing electronic component precursors using liquids of varying temperature.
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