Importance

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Abstract

A method of manufacture of an ink jet print head arrangement including a series of nozzle chambers, the method comprising the steps of: (a) utilizing an initial semiconductor wafer having an electrical circuitry layer formed thereon; (b) etching the circuitry layer to define a nozzle cavity area; (c) plasma etching the wafer in the area of the nozzle cavity area to create a nozzle chamber; (d) depositing and etching a first sacrificial layer so as to fill the nozzle chamber; (e) etching the first sacrificial layer to create an actuator end cavity volume; (f) depositing and etching a first material layer over the first sacrificial layer so as to fill the end cavity volume and to form a lower portion of a thermal actuator unit on the sacrificial layer; (g) depositing and etching a conductive heater layer on top of the lower portion, the conductive heater layer forming a heater element on the lower portion, the heater element being interconnected to the electrical circuitry layer; (h) depositing a second material layer; (i) etching the second material layer and the first material layer down to the sacrificial layer so as to form a slot around the surface actuator and a nozzle chamber nozzle; (j) etching an ink supply channel through the wafer in fluid communication with the nozzle chamber; and (k) etching away the sacrificial material.

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First Claim