Semiconductor device with flat protective adhesive sheet and method of manufacturing the same
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United States of America Patent
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Jun 12, 2001
Grant Date -
N/A
app pub date -
Nov 24, 1999
filing date -
Nov 27, 1998
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A semiconductor device has a semiconductor wafer having sensing portions exposed on a surface thereof and an adhesive sheet attached to the semiconductor wafer as a protective cap to cover the sensing portions. The adhesive sheet is composed of a flat adhesive sheet and adhesive disposed generally on an entire surface of the adhesive sheet. Adhesion of the adhesive is selectively reduced by UV irradiation to have adhesion reduced regions, and the adhesion reduced regions face the sensing portions. The protective cap can be produced with high productivity, and securely protect the sensing portions when the semiconductor wafer is diced and is transported.
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