Method to selectively heat semiconductor wafers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 12, 2001
Grant Date -
N/A
app pub date -
Nov 23, 1999
filing date -
Nov 23, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for manufacturing integrated circuits; particularly, a method to alter heat flow on a localized basis, when heating wafers to elevated temperatures, to achieve different processing temperatures by altering the material properties, such as emissivity, absorptivity and reflectivity, of a portion of a surface by the application of thin films of various materials.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully