Heat processing method and apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 12, 2001
Grant Date -
N/A
app pub date -
Jul 20, 1999
filing date -
Jul 22, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In a heat processing method for heating a wafer mounted on a base inside a process container to 120.degree. C. with a heat generator buried inside the base, a gas pre-heated to 120.degree. C. by a heater passes through the space above the wafer after being rectified so as to be parallel to the wafer by a rectifying board disposed near a supply vent. Thereby, temperature distribution in the space above the substrate is kept uniform during heat processing.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully