Semiconductor device comprised of a ball grid array and an insulating film with preformed land openings
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 12, 2001
Grant Date -
N/A
app pub date -
Dec 14, 1999
filing date -
Dec 15, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device of a BGA (Ball-Grid-Array) package comprises a lead frame, a semiconductor chip, bonding wires, a plastic, an insulation film, and solder balls. The semiconductor chip is mounted on one side of the lead frame, and is electrically connected to the lead frame by the bonding wires. The plastic encapsulates the semiconductor chip and the bonding wires. The insulation film has openings for exposing predetermined regions of the lead frame. The insulation film is affixed onto an underside surface of the lead frame. The solder balls act as connection terminals. The solder balls are formed on the regions of the lead frame exposed through the openings in the insulation film.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully