Probe card having on-board multiplex circuitry for expanding tester resources
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United States of America Patent
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-
Jun 12, 2001
Grant Date -
N/A
app pub date -
May 11, 1998
filing date -
May 11, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A probe card, a test method and a test system for testing semiconductor wafers are provided. The test system includes the probe card, a tester for generating test signals, and a wafer prober for placing the wafers and probe card in physical contact. The probe card includes contacts for electrically engaging die contacts on the wafer. The probe card also includes an on board multiplex circuit adapted to fan out and selectively transmit test signals from the tester to the probe card contacts. The multiplex circuit expands tester resources by allowing test signals to be written to multiple dice in parallel. Reading of the dice can be performed in groups up to the limit of the tester resources. In addition to expanding tester resources, the multiplex circuit maintains the individuality of each die, and permits defective dice to be electrically disconnected.
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