Surface mounted device with grooves on a termination lead and methods of assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 12, 2001
Grant Date -
N/A
app pub date -
Dec 3, 1998
filing date -
Dec 3, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Surface mount device packages with increased mounting strength and a method therefor. In one embodiment, an electronic device is made up of a device package and one or more electrically conductive terminals. For surface mounting, the device terminals are each provided with a mounting surface which is bonded using a conductive adhesive to a corresponding contact pad on a circuit board. The terminals are further provided with at least one groove across the mounting surface. When conductive adhesive is used to mount the device on a circuit board, this groove serves to form the conductive adhesive into a ridge or 'dam' over the contact pad. This provides increased mounting strength which may eliminate the need for additional adhesive material to provide side reinforcement of the device, and thereby allow an increase in the packing density of devices on the circuit board.
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