Semiconductor device capable of cutting off a leakage current in a defective array section and method thereof

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United States of America Patent

PATENT NO 6246627
SERIAL NO

09397239

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Abstract

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The semiconductor device of this invention includes: an array section including a plurality of circuit blocks; a leakage current cutoff section for cutting off a leakage current occurring in at least one of the plurality of circuit blocks in the array section; and a control section for controlling the leakage current cutoff section in accordance with leakage current cutoff information.

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Patent Owner(s)

Patent OwnerAddress
PANASONIC CORPORATION1006 OAZA KADOMA KADOMA-SHI OSAKA 5718501 ?5718501

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akamatsu, Hironori Hirakata, JP 73 1343
Hirata, Takashi Neyagawa, JP 110 1716
Iwata, Toru Osaka, JP 116 1702
Kusumoto, Keiichi Nishinomiya, JP 45 650
Takahashi, Satoshi Hirakata, JP 385 4847
Terada, Yutaka Osaka, JP 54 673
Yamauchi, Hiroyuki Takatsuki, JP 127 1726

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