Photosensitive resin composition
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United States of America Patent
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Jun 19, 2001
Grant Date -
N/A
app pub date -
Dec 7, 1999
filing date -
Dec 8, 1998
priority date (Note) -
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Abstract
Disclosed are photoresist compositions comprising a polymeric backbone and a quaternary heterocyclic pendant group, particularly usefull in the preparation of screen printing and sandblast etching photoresists. The pendant groups comprise furanyl substituted quaternary heterocyclic groups, as seen in the formula: ##STR1## where n ranges from 0 to 4 and Z denotes the atoms necessary to complete a substituted or unsubstituted nitrogen containing heterocyclic ring.
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