Method of manufacturing semiconductor chips for display

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United States of America Patent

PATENT NO 6248606
SERIAL NO

09219137

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Abstract

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In a method of manufacturing semiconductor chips for display, a semiconductor thin film is first formed on an insulating substrate, and then a series of processes including a heat-treatment process for the semiconductor thin film are carried out to form integrated thin film transistors on a sectioned area for one chip. Thereafter, pixel electrodes for one picture (frame) are formed within the sectioned area. During the series of processes, a laser pulse is irradiated onto the sectioned area by one shot to perform a heat treatment on the semiconductor thin film for one chip collectively and simultaneously (i.e., perform a batch heat treatment on the semiconductor thin film). Through the batch heat treatment, the crystallization of the semiconductor thin film is promoted. In addition, after the semiconductor thin film is doped with impurities, the activation of impurities doped in the semiconductor thin film can be performed by the batch heat treatment.

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Patent Owner(s)

Patent OwnerAddress
JAPAN DISPLAY WEST INC50 AZA KAMIFUNAKI O-AZA OGAWA HIGASHIURA-CHO CHITA-GUN AICHI-KEN 470-2102

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hayashi, Hisao Kanagawa, JP 60 1763
Ino, Masumitsu Kanagawa, JP 51 1120
Kunii, Masafumi Kanagawa, JP 30 1173
Minegishi, Masahiro Kanagawa, JP 9 226
Nishihara, Shizuo Kanagawa, JP 10 285
Urazono, Takenobu Kanagawa, JP 10 541

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