Millimeter wave multilayer assembly
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United States of America Patent
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Jun 19, 2001
Grant Date -
N/A
app pub date -
Oct 21, 1999
filing date -
Oct 21, 1999
priority date (Note) -
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Abstract
A millimeter wave multilayer phased array assembly has a multilayer board consisting of several laminated printed wiring boards (PWBs) and a frame having a waveguide input and waveguide output. The PWBs are made of a high frequency laminate material and have a pattern of metalization to perform varying electronic tasks. These tasks include electrical interconnection, RF signal transmission, DC current routing and DC signal routing.
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