Method for transferring a microelectronic device to and from a processing chamber

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United States of America Patent

PATENT NO 6251195
SERIAL NO

09351939

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus having a processing chamber for processing a semiconductor wafer under evacuated conditions that is capable of transfer of the wafer from the processing chamber under conditions that are substantially equal to the pressure of an adjacent environment. In a preferred embodiment, the processing chamber is pressurized and vented with a source of high purity dry gas that is diffused into the chamber through a diffuser to pressurize the processing chamber after processing of the wafer is completed. A chamber equalization port between the processing chamber and the adjacent environment is opened to maintain the pressure within the chamber at or slightly above the pressure of the adjacent environment, and the chamber valve is then opened. The wafer can then be removed from the processing chamber, and a new wafer can be inserted. The chamber is then sealed by closing the chamber valve and the equalization port, and the atmosphere within the processing chamber is evacuated to a desired level. The new wafer is then processed, and the above steps are repeated to remove the wafer once processing has finished.

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Patent Owner(s)

Patent OwnerAddress
TEL FSI INC3455 LYMAN BOULEVARD CHASKA MN 55318

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inhofer, William P Plymouth, MN 5 41
Patrin, John C Chanhassen, MN 3 106
Siefering, Kevin L Excelsior, MN 18 378
Wagener, Thomas J Shorewood, MN 30 472

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