Method of and apparatus for controlling fluid flow and electric fields involved in the electroplating of substantially flat workpieces and the like and more generally controlling fluid flow in the processing of other work piece surfaces as well
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United States of America Patent
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Jun 26, 2001
Grant Date -
N/A
app pub date -
Sep 3, 1999
filing date -
Sep 3, 1999
priority date (Note) -
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Abstract
A novel method and apparatus of wet processing workpieces, such as electroplating semiconductor wafers and the like, that incorporates reciprocating processing fluid agitation to control fluid flow at the workpiece, and where electric fields are involved as in such electroplating, controlling the electric field distribution.
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