Precision spray processes for direct write electronic components
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United States of America Patent
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Jun 26, 2001
Issued Date -
N/A
app pub date -
May 5, 1999
filing date -
May 5, 1999
priority date (Note) -
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Abstract
This invention combines the precision spray process with in-flight laser treatment in order to produce direct write electronic components. In addition to these components, the process can lay down lines of conductive, inductive, and resistive materials. This development has the potential to change the approach to electronics packaging. This process is revolutionary in that components can be directly produced on small structures, thus removing the need for printed circuit boards.
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