EMI/RFI and vibration resistant electronics enclosure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 26, 2001
Grant Date -
N/A
app pub date -
Jan 21, 1999
filing date -
Jan 21, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A panel used in an enclosure for housing at least one electronic component, and an enclosure made of at least one of such panels is disclosed. The panel includes an electrically conductive layer, a separate, magnetically permeable layer connected to the electrically conductive layer, and a separate, extensionally damped layer covering at least 80 percent of a surface of the panel and attached to one or more of the electrically conductive layer and the magnetically permeable layer, where electrical and magnetic conductivity are maintained between all panels of the enclosure, and a ground is provided between circuitry of the electrical component and the electrically conductive layer.
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