Semiconductor chip package using flexible circuit board with central opening
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 26, 2001
Grant Date -
N/A
app pub date -
May 19, 1998
filing date -
Jun 18, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An active surface of a semiconductor chip is attached to the bottom surface of a flexible circuit board having a central opening. Input/output pads on the active surface of the chip are electrically connected to a circuit layer on the top surface of the flexible circuit board through the opening. The semiconductor chip package can thus be of a size on the order of that of the chip. The circuit layer on the circuit board includes bonding pads for receipt of metal wires, land pads for receipt of terminals, and circuit traces connecting the pairs of the bonding and land pads, respectively. The input/output pads, the bonding pads, and the wires are encapsulated in an encapsulant formed by dispensing a liquid resin having a certain viscosity into the opening in the flexible circuit board. A dam around the opening prevents the liquid resin from overflowing. The flexible circuit board may further include a protective layer for protecting the circuit traces, a stiffener, or an adhesive layer thereunder. The protective layer may have a groove in which the dam is formed.
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