US Patent No: 6,254,719

Number of patents in Portfolio can not be more than 2000

Method for controlled removal of material from a solid surface

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Abstract

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A catalytic method and an apparatus for selectively removing material from a solid substrate is provided. The method comprises contacting a surface of a solid substrate with a catalyst material in the presence of a reactant under conditions effective to selectively remove material from those areas of said solid substrate in contact with said catalyst material and said reactant.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY77509

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheek, Roger W - 52 298

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
4,968,552 Versatile reactive ion etch barriers from polyamic acid salts 13 1989
5,780,363 Etching composition and use thereof 19 1997
6,022,485 Method for controlled removal of material from a solid surface 2 1997
 
ADVANCED TECHNOLOGY MATERIALS, INC. (1)
5,680,008 Compact low-noise dynodes incorporating semiconductor secondary electron emitting materials 19 1995
 
Allied Corporation (1)
4,582,581 Boron trifluoride system for plasma etching of silicon dioxide 12 1985
 
AT&T Bell Laboratories (1)
5,328,550 Thinning a diamond body by means of molten rare-earth-containing alloys 4 1992
 
CANON KABUSHIKI KAISHA (1)
5,135,607 Process for forming deposited film 15 1991
 
E. I. DU PONT DE NEMOURS AND COMPANY (1)
5,032,216 Non-photographic method for patterning organic polymer films 44 1990
 
GCA Corporation (1)
4,506,005 Method of catalytic etching 7 1983
 
GLOBALFOUNDRIES INC. (1)
6,031,289 Integrated circuit which uses a recessed local conductor for producing staggered interconnect lines 5 1998
 
MASSACHUSETTS INSTITUTE OF TECHNOLOGY (1)
5,713,775 Field emitters of wide-bandgap materials and methods for their fabrication 18 1995
 
NEC CORPORATION (1)
6,008,136 Method for manufacturing semiconductor device capable of improving etching rate ratio of insulator to refractory metal 5 1997
 
NGK SPARK PLUG CO., LTD. (1)
5,196,089 Multilayer ceramic substrate for mounting of semiconductor device 7 1991
 
PSI Star (1)
4,466,859 Process for etching copper 15 1983

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