Methods for fabricating multi-component devices for molecular biological analysis and diagnostics
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United States of America Patent
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Jul 3, 2001
Grant Date -
N/A
app pub date -
Jan 29, 1999
filing date -
Nov 1, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
A method for manufacturing a multicomponent flip-chip device is disclosed. The device includes a chip disposed adjacent to a substrate, the substrate including a via therethrough. The device is adapted to receive a fluid to be placed on the substrate, wherein the fluid then flows through the via down to the chip. The chip includes a sealant free region and a sealant receiving region. The method includes the steps of placing a chip adjacent to a substrate. Light is exposed to the substrate and through the via, down onto the surface of the chip. A light-curable, wickable sealant is applied to the interface between the substrate and the chip, wherein the light at least partially cures the sealant to preclude the sealant from flowing to the sealant free region. Additional curing of sealant may also be performed.
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