Process for producing microencapsulated electroconductive filler
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United States of America Patent
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Jul 3, 2001
Grant Date -
N/A
app pub date -
Jun 23, 1998
filing date -
Jun 23, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for producing a microencapsulated electroconductive filler comprising conductive filler particles each having an insulating resin coated on the surface thereof, which comprises: a first step of treating the surface of conductive filler particles with a coupling agent having reactive functional group A at a terminal end or in a side chain of its molecule; and a second step of allowing the coupling agent having functional group A present on the surface of the conductive filler particles to undergo nonaqueous polymerization reaction with a reactant B which is polymerizable with the functional group A, to thereby form an insulating resin layer on the surface of the conductive filler particles.
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