Apparatus for ablating high-density array of vias or indentation in surface of object
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jul 3, 2001
Issued Date -
N/A
app pub date -
Mar 31, 2000
filing date -
Oct 8, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An imaging system for ablating an array matrix of high-density vias in a flexible and rigid desired object. The apparatus contains a mirror based x, y scanning repeat positioning and/or a single axis scanner positioning system that directs a single point of a coherent light radiation beam at desired individual mask segments. These mask segments are formed into a planar mask array. A flat field collimating lens system is positioned between the mirror scanning system and the mask arrays to correct the angular beam output of the repeat positioning mirror and redirects the beam so that it strikes a specific rear surface segment(s) of in the mask array. The flat field collimating lens provides a beam that either illuminates the mask perpendicular to its surface or at preselected optimized illumination angles. Once illuminated, the specific segment of the mask array images and processes a single or a plurality of desired holes or features in a top surface of a flexible or rigid desired object to be processed.
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