Multi-thickness, multi-layer green sheet processing
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United States of America Patent
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Jul 10, 2001
Grant Date -
N/A
app pub date -
Feb 10, 1999
filing date -
Feb 10, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates generally to using at least one green sheet that is originally very thin with the help of at least one thicker green sheet. At least one organic adhesion barrier is used to build the multi-layer ceramic laminates. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-density, multi-layer ceramic products using at least one very thin green sheet and/or at least one green sheet with very dense electrically conductive patterns secured to at least one thicker green sheet using at least one organic adhesion barrier.
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