Composition for stripping solder and tin from printed circuit boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 10, 2001
Grant Date -
N/A
app pub date -
Oct 1, 1997
filing date -
Oct 1, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A composition and method for stripping tin and solder and the underlying tin-copper alloy from the copper substrate of a printed circuit board is presented. The liquid includes an aqueous solution of nitric acid in an amount sufficient to dissolve solder and tin, a source of ferric ions in an amount sufficient to dissolve the tin-copper alloy, and a source of halide ions in an amount sufficient to significantly improve the resistance between printed circuits.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully