Dummy patterning for semiconductor manufacturing processes
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United States of America Patent
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Jul 10, 2001
Grant Date -
N/A
app pub date -
Mar 4, 1999
filing date -
Mar 4, 1999
priority date (Note) -
In Force
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Abstract
A method is provided for inserting dummy conductive channels along with the interconnected conductive channels. The dummy channels have an approximately even metal weight distribution to provide better plating uniformity, minimize CMP dishing, improve process heating uniformity, improve spin-on process properties, and increase etch and lithography uniformity.
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