Method and apparatus for electrically testing semiconductor devices fabricated on a wafer
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United States of America Patent
Stats
-
Jul 10, 2001
Grant Date -
N/A
app pub date -
Apr 16, 1999
filing date -
Apr 16, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A probe head replaces the probe card conventionally used to electrically test circuits on semiconductor wafers. Within the probe head, an array of pins is biased in a retracted position. A corresponding array of leads is biased in an extended position. By clamping a selector card with one or more apertures between the pin array and the nail array allows selected leads to extend into contact with corresponding pins so as to extend those pins for use in testing a wafer. The selector card can be quickly replaced to obtain a different pin pattern in the probe head. The probe head is movably mounted so as to be positioned, and appropriately repositioned, with respect to the wafer being tested.
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