Substrate process method and substrate process apparatus
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United States of America Patent
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Jul 17, 2001
Grant Date -
N/A
app pub date -
Jul 29, 1999
filing date -
Jul 29, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.
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