Composition and method for removing probing ink and negative photoresist from silicon wafers enclosures
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United States of America Patent
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Jul 17, 2001
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N/A
app pub date -
Nov 24, 1998
filing date -
Nov 24, 1998
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Expired
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Abstract
A composition and method for removing probing ink and negative photoresist from a substrate with reduced metal corrosion, low toxicity and rapid removal rates. The composition includes a mixture of anisole, an alkylarylsulfonic acid, and aliphatic hydrocarbons containing 9 to 13 carbon atoms.
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