Method of making a package for microelectronic devices using iron oxide as a bonding agent
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United States of America Patent
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-
Jul 17, 2001
Grant Date -
N/A
app pub date -
Mar 13, 1998
filing date -
Mar 13, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A package for a microelectronic device, and a method for making the package, include a thermally conductive base containing a metal composite including a high conductivity metal and a ferrous alloy, the base having a surface with an iron oxide deposit disposed thereon. An insulating substrate is disposed on the surface of the base, the substrate having an aperture formed therein for exposing a portion of the surface of the base for mounting the device on the base. A conductive lead has a portion thereof embedded within the insulating substrate and is adapted to be electrically connected to the device. The insulating substrate is bonded to the iron oxide deposit disposed on the surface of the base, such as by heating.
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