Etch bias distribution across semiconductor wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 17, 2001
Grant Date -
N/A
app pub date -
Dec 1, 1998
filing date -
Dec 1, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Test wafers used in the production of semiconductor wafers include a plurality of active structures which form operational circuitry of the test wafer. The active structures are densely populated in some areas of the test wafer and sparsely populated in other areas of the test wafer. It has been observed that critical dimensions such as etch bias and slope profiles of identical structures vary depending on whether the structure is formed in a densely or sparsely populated region. Dummy structures are formed on the test wafer so as to uniformly distribute the density of structures across the test wafer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully