Ball grid array electronic package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 17, 2001
Grant Date -
N/A
app pub date -
Mar 19, 1993
filing date -
Mar 19, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is provided a ball grid array package for housing semiconductor devices. The package has a metallic base with conductive vias extending through holes formed in the base. The conductive vias terminate adjacent an exterior surface of the base. A dielectric coating on at least part of the base and through hole walls electrically isolates the metallic base from the package circuitry.
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