Laminate RFID label and method of manufacture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 17, 2001
Grant Date -
N/A
app pub date -
Jan 13, 1999
filing date -
Jan 13, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A laminated label has a first conductive material defining electrical attachment pads; a dielectric material surrounding the attachment pads; a second conductive material deposited on the dielectric material and forming an antenna electrically connected to the attachment pads. A layer of expandable material forms a protective cavity surrounding the attachment pads. An IC chip is received in the protective cavity and connected to the antenna.
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