Method for forming a solder ball
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United States of America Patent
Stats
-
Jul 24, 2001
Grant Date -
N/A
app pub date -
Jun 19, 2000
filing date -
Sep 6, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This invention provides screen printing for forming a higher solder ball (bump). In first printing step, a first solder layer is printed. After drying in drying step, a second solder layer is printed on the first solder layer in second printing step. Then, in re-flow processing step, re-flow processing is performed, and the first solder layer and the second solder layer are melted. Finally, the melted layer is solidified in a ball shape to form the solder ball (bump). Since solder paste is printed in layers, an amount of the solder paste can be increased. Hence, a higher solder ball (bump) can be formed.
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