Process for reclaiming a suspension
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 24, 2001
Grant Date -
N/A
app pub date -
Mar 16, 2000
filing date -
Mar 18, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for reclaiming a suspension which is produced during the machining of semiconductor material and which contains a liquid, a substance with an abrasive action and abraded semiconductor material, includes separating off the substance with an abrasive action and then separating the liquid and the abraded material. In the process, the liquid and the abraded material are separated with the aid of a magnetic separator.
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