Electroless metal deposition on silyl hydride functional resin
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United States of America Patent
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Jul 24, 2001
Grant Date -
N/A
app pub date -
Jun 8, 1999
filing date -
Jun 10, 1998
priority date (Note) -
Expired
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Abstract
A method for selective electroless metal deposition on a substrate. The method comprises applying a patterned coating comprising a silyl hydride functional resin onto a substrate. An electroless plating solution comprising a metal ion is then applied onto the silyl hydride functional resin coating to deposit a patterned metal film on the substrate. The process of the invention is especially useful in the electronics industry.
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