Radiation curable resin composition
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United States of America Patent
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Jul 24, 2001
Grant Date -
N/A
app pub date -
Dec 11, 1998
filing date -
Jun 14, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A radiation curable resin composition comprising (A) a first linear (meth)acryloyl and aromatic group-containing compound, (B) a second branched (meth)acryloyl group-containing compound, (C) a radiation polymerization initiator, and (D) silica particles having a secondary average particle diameter of 0.5 to 5 .mu.m. The composition is suitable for use as a printable heat-resistant protective coat which is used for information recording media such as thermosensible recording cards and thermosensible photographic printing paper.
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