Covered slit isolation between integrated circuit devices

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United States of America Patent

PATENT NO 6265754
SERIAL NO

09687022

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Abstract

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A capped slit provides isolation between adjacent devices of an integrated circuit. The cap and slit provide very high immunity to punchthrough and protect the edge of the slit against becoming exposed during subsequent processing that could otherwise remove field oxide. In one embodiment, the capped slit isolates two cells of a flash EEPROM device, and the field oxide lines the slit and serves as the tunneling oxide in the cells. In another embodiment, the slit is filled with a plug of dielectric material.

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Patent Owner(s)

Patent OwnerAddress
CHIP PACKAGING SOLUTIONS LLC6136 FRISCO SQUARE BLVD SUITE 385 FRISCO TX 75034

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sung, Kuo-Tung Hsinchu, TW 36 500

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