Wafer probe card
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United States of America Patent
Stats
-
Jul 24, 2001
Grant Date -
N/A
app pub date -
Mar 24, 1999
filing date -
Mar 27, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus to heat and test a semiconductor wafer includes a probe card and tests a plurality of die simultaneously at the wafer level. In the present invention, the apparatus heats the wafer to sufficient temperatures to perform burn-in and a speed test. A method of testing the semiconductor allows certain die to be repaired that would otherwise be scrapped in a conventional process where bun-in and other tests are performed on packaged die. The method also eliminates steps associated with handling individually packaged parts, reduces burn-in space and consolidates certain test steps.
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